Submitted by anandtech5517 in technology
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has...
Submitted by anandtech5517 in technology
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has...